SOI Hybrid Laser Model

Photon Design has just released a new XY Laser Module for their laser modeling software HAROLD which is fully capably of simulating Silicon-on-insulator (SOI) hybrid laser structures.

Harold's XY Laser Module extends HAROLD's algorithm so that the lateral structure of laser devices is accounted for. It uses the same physical model as a HAROLD 1d simulation but solves the electrical/optical/thermal problem on a 2D (XY) grid, the starting point being a 2D cross-section, rather than a single 1D epilayer stack. In addition, it supports insulating layers and graded etching and allows n and p-contacts can be on the top of the structure.

This optional HAROLD module performs 2D XY simulations of FP laser devices, allowing lateral structure to be modelled in detail.

- Compute the current flows in XY, active-layer diffusion in X, thermal diffusion in XY, and everything self-consistent with a rigorous hetero structure model of the quantum wells.
- Cross-section editor: define the 2D cross-section of your device, which can include graded etching and insulating layers.
- Simulation results: obtain laser characteristics and 2D profiles of numerous quantities, such as current density, Fermi energies, temperature etc.
- Fully capable of simulating Silicon-on-Insulator (SOI) hybrid structures.

SOI Hybrid Laser

In addition to Per Bias results (i.e. vs. bias current/voltage/current density), Harold XY produces 2D lateral-vertical profiles of various quantities, including:

  • Electrostatic potential and electric field (vector plot)
  • Electron and hole Fermi energies
  • Conduction and valence band edges
  • Electron and hole densities (in bulk and QWs)
  • Electron and hole current densities (vector field plots)
  • Recombination rates: SRH, Auger, spontaneous emission, stimulated
  • Temperature
  • Optical mode

Example: SOI Hybrid Laser Model

What is HAROLD?
HAROLD provides detailed hetero-structure laser diode modeling. Including bandgap narrowing, quantum wells - capture/escape, recombination, strain, drift-diffusion, power dissipation effects. Can be used as a stand-alone product or complementary to PICWave.
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